To: Dr. Erika Paterson, ENGL 301 Instructor, <erika.paterson@ubc.ca>
From: Justin Tang, ENGL 301 Student, <jtang102@student.ubc.ca>
Date: April 15, 2023
Subject: Submission of Application Package
As per lesson 4.2 requirements, please find enclosed my application package for the Software Engineer Intern position at Texas Instruments. Within the application package you will find:
- A picture of the job posting with an MLA reference
- Cover Letter
- Resume
- Three reference request letters
Thank you for finding the time to read my application package, I look forward to your feedback. Please email me at justinn.tangg@gmail.com if you have any questions.
Enclosure: ENGL 301 Application Package Justin Tang
Leave a Reply