Attached is the PDF of my application package for Texas Instrument’s Software Engineering Internship. The application package includes the job posting, my cover letter, resume, and three reference request letters.

ENGL 301 Application Package Justin Tang

Texas Instruments Software Engineering Intern Application Page

Texas Instruments’s Software Engineering intern position is a four month internship program that starts in September 2023. This position is designed to provide students the opportunity to gain real world experience in software engineering.

Cover Letter

The cover letter portion of my application details how my experience and qualifications make me a good fit for the Software Engineering Intern position.

Resume

The resume portion of my application package provides a summary of relevant education, job experience, skills, and technical projects.

Reference Request Letters

The reference request letter section is where I provided three letters requesting references from current and former course instructors, as well as the current director of the BCS program.